Fully Automatic High Precision Eutectic Die Bonding Machine
The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (15-35s/pcs) and high precision (±0.5~±3μm) .
AOI Inspection Machine
The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components.
BECOMING A LEADER IN CORE VALUE
Suzhou Bozhon Semiconductor Co., Ltd. is a wholly-owned subsidiary of Bozhon Precision Technology Co., Ltd. (stock code: 688097), relying on Bozhon Precision Technology's more than 20 years of technological accumulation and focusing on semiconductors. And through industry university research cooperation with well-known domestic universities such as Tsinghua University and Harbin Institute of Technology, we provide high-precision, high-speed, and stable semiconductor mounting equipment that meets advanced packaging requirements for customers in fields such as AI and optical communication, as well as efficient chip AOI inspection equipment.
20+
More than 20 years of technical precipitation
60%
Ratio of R&D personnel
10+
Global regional layout
4,0000
M2
Production base area
Go tech! Go core!
We are committed to developing highprecision chip mounting, AOI optical detection, multi chip packaging and crystal solidification, etc Series devices. The product is widely used in photoelectron, laser, sensor, power semiconductors, microwave radio frequency, semiconductor inspection and other industries.
News
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Corporate News2023-11-17Optical Union Future | Bozhon Semiconductor Attends the World Optical Communication Conference
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Corporate News2023-11-02Highlights | A look back at Bozhon Semiconductor's trip to Productronica China
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Corporate News2023-09-13Interview with Bozhon Semiconductor: Full-stack Self-Research Helps Optical Communication Upgrade
